A Compositional Approach to Performance Modelling by Jane Hillston

By Jane Hillston

This can be the 1st e-book featuring a stochastic extension of strategy algebra, PEPA; this is often proven to be compatible for specifying a Markov strategy, which may then be utilized to functionality modelling. the tactic, that's illustrated with case reviews taken from the realm of communique platforms, can comfortably be used to build various types that may be analysed utilizing common numerical concepts. one of many significant benefits of PEPA over the normal equipment for specifying stochastic functionality types is the inherent gear for reasoning in regards to the constitution and behavior of versions. within the later chapters this gear is exploited to outline 4 equivalence kinfolk over PEPA parts. every one of those notions of equivalence has intrinsic curiosity from a approach algebra standpoint. in spite of the fact that, also they are proven to be worthwhile in a functionality modelling context. To finish the booklet, a bit has been further surveying fresh ends up in the world and discussing open questions.

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About 108 bit s−1 . Inter-chip data transfer rates of 108 or 109 bit s−1 are modest, even by present-day standards. At first sight, it would appear to be quite simple to have edge connections to transfer the data from one layer to another. However, this would be very undesirable, because the data have to be collected from 500 000 uniformly distributed PEs in each layer, then passed from one layer to another, then re-distributed on the next layer. This would involve large high-speed 2D data buses and line drivers on each layer, with an accompanying heat dissipation of perhaps 1 W per layer.

A single 625 µm-thick silicon die patterned with aluminium was also measured. The underfill thickness varied between 5 and 150 µm. 8, middle) had the vias distributed over the area of the die. Vias were (a) 50 µm2 on a 100 µm pitch, (b) 20 µm2 on a 240 µm pitch and (c) 10 µm2 on a 60 µm pitch. 8, right) were at the periphery only. Silicon die thickness for the stacked structures was 50 µm. In the laser flash technique, the sample is placed in a vacuum chamber and the output from a pulsed laser is applied to one face of the sample.

50th IEEE Electron. Components Technol. Conf. pp 1467–9 [12] Yamaji Y, Ando T, Morofuji T, Tomisaka M, Sunohara M, Sato T and Takahashi K 2001 Thermal characterization of bare-die stacked modules with Cu through-vias Proc. 51st IEEE Electron. Components Technol. Conf. pp 730–7 [13] Fountain T J and Freeman H (ed) 1988 Introducing local autonomy to processor arrays Machine Vision—Algorithms, Architectures and Systems (New York: Academic) [14] Duff M J B and Fountain T J (ed) 1986 Celluar Logic Image Processing (New York: Academic) [15] Danielsson P E 1981 Getting the median faster Comput.

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